Electrical insulating material

Mainly used for insulation of motor and electrical appliances, such as armature slot wedge, stator winding and rotor winding in generator and motor. According to the shape, it can be divided into six categories: insulating paint, resin solution and adhesives. For example, insulating impregnating paint, silicon steel sheet paint, enameled wire paint, encapsulating resin liquid and various adhesives are commonly used such as epoxy resin, polyester, polyurethane, organosilicon resin, polyimide alkyd resin (see alkyd resin coating). (2) Impregnated fibre products. For example, insulating fabrics and belts made by impregnating various kinds of cotton, silk, synthetic fibers and glass fibers or fabrics with resin. (3) laminated products. A variety of organic or inorganic substrates impregnated with resin laminates, such as a variety of laminates. (4) Plastic products. It is made by adding various organic or inorganic fillers into the resin, such as TV case, instrument case, instrument case, electrical switch connector case, etc. _Film, synthetic paper and their composite products. For example, a variety of polymer film capacitor dielectric materials, commonly used polystyrene, polypropylene, polyester, polycarbonate, polytetrafluoroethylene, polyimide and other films; various synthetic fiber insulation paper, such as aromatic polyamide fiber paper, polyester fiber paper; various insulation tapes, insulation tapes, etc. Rubber products. For example, various insulating layers and sheaths of wires and cables, heat shrinkable tubes, silicone rubber insulating terminals, etc.  
Electronic insulating materials

It is mainly used for the insulation protection of semiconductor components and electronic devices. (1) Printed circuit board, i.e. copper-clad foil plate. The base material is resin laminated sheet, called rigid copper clad foil plate, often using epoxy, phenolic resin board; the base material is polymer film or single layer heat-resistant glass lacquer cloth, it is called flexible copper clad foil plate, often using polyester, polyimide, fluorine-containing polymer film. (2) Packaging materials are used to prevent the influence of external moisture and impurities on the parameters of semiconductor components. At present, more than 90% of semiconductor components are encapsulated in plastic. It mainly uses epoxy resin and organic silicone resin, followed by phenolic resin, polyester, polybutadiene and so on. (3) The insulating film for semiconductor devices is the surface protection film (including contact coating, passivation film, moisture-proof and shock-proof film, alpha-ray shielding film to prevent soft errors) and interlayer insulation film for semiconductor devices such as conventional film integrated circuits. For example, polyimide-based aromatic heterocyclic polymers.